| 摘要 |
An electroacoustic component including a layer system disposed between two substrates and electroacoustic structures for exciting a guided bulk acoustic wave, the electroacoustic structures being devoid of cavities. The layer system includes a piezo-electric layer, at least one metal layer, and a planarizing layer, which includes a planar interface provided with a substrate disposed directly thereabove. Such a component can be produced at a low cost by direct wafer bonding of two wafers. The electroacoustic component structures are electrically connected to the external contacts through perpendicular electrical connections.
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