| 摘要 |
PROBLEM TO BE SOLVED: To lower the production cost of semiconductor devices by increasing in use of dummy substrates and controlling scattering of fragments of breakage at the time of substrate processing such as cleaning using a drum type rotating cleaning system. SOLUTION: The method of processing substrate includes a step of putting a plurality of substrates to be processed 104 into a plurality of containers 204 respectively, a step of putting required number of dummy substrates 100, having mass substantially same as the substrate 104, made of plates at least two of whose main faces including side faces are coated by chemical-resistant resin, into a plurality of containers 204 so that the total number of the substrates 104 contained by the plurarity of containers 204 and the dummy substrates 100 may be same in the all of the containers 204, and a step of symmetrically arranging the plurarity of containers 204 containing the dummy substrates 100 around the rotation axis and processing the substrates 104 with rotating around the axis. COPYRIGHT: (C)2008,JPO&INPIT
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