发明名称 SOLID-STATE ELECTROLYTIC CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a solid-state electrolytic capacitor where a conductive pattern of a printed board and a spacer are electrically bonded with a conductive adhesive and superior characteristics are provided with low ESR. SOLUTION: Between an end 11B of an anode 11 of a first capacitor element acting as a first layer of laminated four capacitor elements and a first conductive pattern 51A of the printed board 50, a board connecting spacer 62 is provided including a spacer main body 62A made of a copper (Cu). A base plating layer 62B made of a nickel (Ni) is provided to all around the spacer main body 62A, and further a precious metal plating layer 62C made of a gold (Au) is provided thereon. The precious metal plating layer 62C of the lower surface of the board connecting spacer 62, and a board side precious metal layer 51D of the first conductive pattern 51A, are electrically connected with a conductive paste 71. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008028298(A) 申请公布日期 2008.02.07
申请号 JP20060201758 申请日期 2006.07.25
申请人 TDK CORP 发明人 MATSUSE MITSUTAKA;SATO HIRONOBU;DOMON TAKAAKI
分类号 H01G9/012;H01G9/004 主分类号 H01G9/012
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