| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a lead frame that can reduce the manufacturing cost, and to provide a lead frame manufactured by the manufacturing method. SOLUTION: The lead frame is connected with a sealed electronic device, has a curvature at a sealed part, and has a resinous locking part with an reverse tapered shape for preventing deterioration of the electronic device, by the moisture entering from the outside of the sealing via the curvature. Its manufacturing method has the steps of forming a depressed portion whose opening end-to-end distance has a predetermined width size, at a position corresponding to the curved portion of a plate-like member for the lead frame, and forming the curved portion, as well as, forming the resinous locking part by pressuring the plate-like member to make closer the opening ends. COPYRIGHT: (C)2008,JPO&INPIT
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