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发明名称
Epoxy resin composition for encapsulating semiconductor device
摘要
申请公布号
KR100826107(B1)
申请公布日期
2008.04.29
申请号
KR20060134172
申请日期
2006.12.26
申请人
发明人
分类号
C08L63/00;C08G69/50;C08G73/02
主分类号
C08L63/00
代理机构
代理人
主权项
地址
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