| 摘要 |
A method of forming a silicon-on-insulator semiconductor device including providing a substrate, forming an insulating layer on the substrate, forming a process layer on the insulating layer, implanting ions into the process layer adjacent the insulating layer, and forming a strained silicon layer over the process layer. Implanting ions into the process layer adjacent the insulating layer reduces floating body effects of the semiconductor device, while the strained silicon layer covers surface defects form by the implanted ions in the process layer to enhance mobility of the semiconductor device.
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