| 摘要 |
A printed circuit board for the semiconductor package and a method of manufacturing the same are provided to prevent the solder from being formed between the solder masks and to prevent the flux of solder from remaining on the interface of the solder mask and the connection pad. The circuit wiring is formed in upper side and lower side and inside of the insulating layer(210). The solder mask(220) covers the upper side and lower side of the insulating layer. The solder mask is patterned to expose a portion of the circuit wiring of the upper side of the insulating layer. Therefore, the connection pad region(214) is segmented with the patterned solder mask. The metal layer(240) is formed on the circuit wiring part of the exposed connection pad region. The solder(230) can be formed on the metal layer of the connection pad region. |
