Providing a plastic substrate with a metallic pattern

摘要

The invention is directed to a method of providing a plastic substrate (1) with a metallic pattern (8) and to a plastic substrate (1) with a metallic pattern (8) obtainable by said method.
The method of the invention comprises
i) replicating a pattern of recesses and protrusions on a plastic substrate (1) by pressing a stamp having recesses and protrusions against the substrate, thereby providing said plastic substrate (1) with recesses and protrusions;
ii) removing said stamp from said substrate;
iii) - providing a layer of seed material (2) capable of initiating an electroless or electrochemical metal deposition process onto said plastic substrate at least in the recesses of said plastic substrate;
- optionally providing a layer of inhibitor material on top of or below said layer of seed material (2); and
- if necessary, etching excess seed material (2) and/or excess inhibitor material (3),
to yield a substrate wherein said seed material (2) and/or said inhibitor material (3) remains selectively in the recesses or on the protrusions of said substrate; and thereafter
iv) using said seed material (2) to initiate a metal deposition process.