| 发明名称 |
ADHESIVE COMPOSITION AND ADHESIVE FILM USING THE SAME |
| 摘要 |
<p>Disclosed is a thermosetting adhesive composition containing (A) a modified polyamideimide resin which can be dissolved in an organic solvent, (B) a thermosetting resin, and (C) a curing agent or a curing accelerator.</p> |
| 申请公布号 |
KR20100009575(A) |
申请公布日期 |
2010.01.27 |
| 申请号 |
KR20097024109 |
申请日期 |
2008.05.20 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
NAKAMURA SHIGEHIRO;ITOU TOSHIHIKO;MANSEI YOUICHIROU |
| 分类号 |
C09J179/08;C09J7/02 |
主分类号 |
C09J179/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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