| 摘要 |
<p>PURPOSE: A rapid conductive cooling using a secondary process plane is provided to perform a rapid heating and cooling of substrate by shifting a heat zone and an active cooling zone. CONSTITUTION: A substrate processing apparatus comprises a chamber, a heat source, a refrigeration source, a magnetically driven substrate support, and a transparent window(114). The heat source and the refrigeration source are arranged within the chamber in order to be opposite with each other. The magnetically driven substrate support is arranged within the chamber. The magnetically driven substrate support has a circular body. The substrate(140) is supported on a circular body. The transparent window is arranged between the heat source and the substrate.</p> |
