Integrated Circuit Package and Methods of Forming Same

摘要

A method for forming integrated circuit packages is presented. A first plurality of first tier stacks are mounted to the substrate, wherein the substrate has one or more contact pads corresponding to each of the first tier stacks and has one or more probing pads associated with each of the first tier stacks. Each of the first tier stacks is electrically tested to identify known good first tier stacks and known bad first tier stacks. A first plurality of stacking substrates are mounted to the known good first tier stacks, thereby forming a plurality of second tier stacks. Each of the second tier stacks is electrically tested to identify known good second tier stacks and known bad second tier stacks.

主权项

1. A package comprising:
a substrate, the substrate having a first side and a second side, the second side being opposite the first side; a stack of dies on a first side of the substrate; a probing pad on the first side of the substrate, the probing pad being electrically coupled to the stack of dies; and a contact pad on the second side of the substrate, the contact pad being electrically coupled to the stack of dies.