MANUFACTURE OF SEMICONDUCTOR DEVICE MOUNTING SUBSTRATE

摘要

PURPOSE:To prevent nickel plating from peeling off by removing a deformed part in a thin plate surface of aluminum or aluminum alloy and by performing nickel plating for the part. CONSTITUTION:An aluminum or aluminum alloy layer is formed on the surface of a ceramic substrate 11 whereon a semiconductor device is mounted and the entire surface of the layer is mechanically polished. Resist of a specified pattern is applied to the mechanically polished surface and a specified part of the mechanically polished surface whereto the resist is not applied is chemically polished. A nickel plating layer 14 is formed in the specified part. Therefore, the deformed part is removed by chemical polishing and nickel plating is performed for the surface which is not deformed. The nickel plating layer 14 is thereby completely prevented from peeling off an aluminum or aluminum alloy layer.