| 摘要 |
1,046,173. Semi-conductor devices. FUJITSU Ltd. Oct. 19, 1964 [Oct. 17, 1963]. No. 42622/64. Heading H1K. A glass sealed semi-conductor or other electrical device is produced by arranging an electrode 1 with glass bead 2 in an opening in cup-shaped envelope 4, sealing the bead to the envelope by heating and while the glass is still malleable, moving the electrode 1 to contact the semi-conductor element 5. This produces a stress-free contact between the electrode and the semi-conductor. A ball 8 of gold, nickel or tin may be provided between the electrode contact ribbon 3 and the semi-conductor to provide good contact. Production may be carried out by means of a turntable holder which rotates to position the devices at work stations for the various process stages. |
