发明名称 MOLTEN-SALT ELECTROPLATING DEVICE
摘要 PURPOSE:To improve the durability of the device and to produce a good plated material by forming at least a part of the surface of the AlCl3-contg. molten-salt electroplating device in contact with the molten-salt plating bath with Al or an Al alloy. CONSTITUTION:A molten-salt plating bath with AlCl3 such as AlCl3-XCl (X is alkali metals) as one component is used to electroplate a substrate metal such as steel sheet with Al or an Al alloy, and the resistance to corrosion and heat is improved. In this molten-salt electroplating device, at least a part of the surface of the device in contact with the bath is formed with Al or an Al alloy or Mn, Ti Mg and their alloy. These materials are used as the sacrificial anode, or further the device can be cathodically protected by an external power source. In this case, the potential of the metallic material in the bath is preferably controlled to -0.2 to +0.5V with respect to the potential of pure Al. Ferritic stainless steel is preferably used as the metallic material of the device.
申请公布号 JPH05186892(A) 申请公布日期 1993.07.27
申请号 JP19920003284 申请日期 1992.01.10
申请人 SUMITOMO METAL IND LTD;MITSUBISHI HEAVY IND LTD 发明人 UCHIDA JUNICHI;TSUDA TETSUAKI;YAMAMOTO YASUHIRO;SETO HIROHISA;FUKUI KUNIHIRO;ABE MASARU;TARUYA YOSHIO;YONEDA JUNKICHI;HASHIMOTO RITSUO;TAGUCHI TOSHIO
分类号 C25D3/66;C23F13/00 主分类号 C25D3/66
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