| 摘要 |
This disclosure relates to improvements in methods and in means for accomplishing electrical wiring. The method makes use of a bonding tool which is capable of furnishing energy sufficient to bond a conductor to a circuit point. The conductor is positioned over that point in the line of action of the tool. Bonding energy is applied to complete the bond. The standing part of the conductor is grasped at a point along its length adjacent to but removed from the bond and it is pulled sufficiently to break the conductor adjacent the bond. Grasp of the conductor is maintained and its broken end is then positioned to lie in the line of action of the bonding tool so that the two can be moved together to another circuit point. Advantageously, these are made the end steps, those applicable to completion of a second bond, in a process which includes additional steps by which a first bond is completed. The means envisioned by the disclosure includes a bonding tool and a clamp mounted for movement with the bonding tool but capable of independent movement so that it can break the standing part of a length of conductor wire after completion of a circuit run and so that it can position the broken end properly to initiate another circuit run. In addition to the bonding tool and the clamp and the means to move them together, apparatus is disclosed by which the proper coordination between these several elements is assured.
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