| 摘要 |
PURPOSE:To enable high density mounting of a semiconductor package and to reduce the size of a semiconductor package by forming vertically an interconnecting wiring plate with respect to a printed board and carrying semiconductor packages on both sides of the plate. CONSTITUTION:The terminals of an LSI 2 or the like are bonded and connected to the terminal surfaces of both right and left side surfaces of an interconnecting wiring plate 10 formed with a conductor pattern and a terminal surface of a ceramic substrate or the like. Then, connecting terminal pads 12 and connecting terminals 14 formed on both lower end surfaces of the plate 10 are reflow bonded and connected. Thus, the plate 10 is carried vertically on a header 13. Connecting terminals 15 on both side surfaces of the header 13 are reflow bonded and secured to the connecting pads 16 of the printed board 4. Then, cooling fins 11 are secured fixedly to both side surfaces of the LSI 2. |
