| 摘要 |
The invention deals with a multilayer ceramic capacitor device with side surtaces (70, 80) parallel to the embedded electrodes.
<??>The ceramic chip capacitor has a pair of metal foil terminal leads (100, 110) characterized in that each strip portion (1Q1, 102) has a first extension (103, 104) overlying the metallized portion (33, 34) and most of the unmetalliced portion of one side surface (70, 80) and a second extension (105, 115) of L-shaped cross-section overlying the metallized end surface (30, 40) and the metallized portion (33, 43) of the opposed side surface (70, 80).
<??>This metal foil strip configuration results in ceramic chip capacitors of reduced high frequency inductance.
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