发明名称 CONNECTING METHOD FOR HYBRID INTEGRATED CIRCUIT SUBSTRATE TO SEMICONDUCTOR PELLET
摘要 PURPOSE:To enable an electric connection once without necessity of connecting wire by pressing a pellet on a connecting pattern of a substrate passing a laser light, then emitting the laser light from the back surface of the substrate, and melting the pattern partially. CONSTITUTION:A thin NiCr film layer 7 and a thin Au film layer 8 forming a connecting pattern are patterned in the laminated state on a substrate 6 passing a laser light. An bump 9 is projected partly at the layer 8. The electrode land of the pellet 10 is contacted with the bump 9. In the state that the pellet 10 is pressed from above, the laser light 11 is emitted to the center of the bump 9 from the back surface of the substrate 6. Then, the bump 9 is heated and molten, and is thermally connected with the electrode land of the pellet. In this manner, the mounting of the pellet and the electric connection can be performed by one operation without necessity of the wire.
申请公布号 JPS57106141(A) 申请公布日期 1982.07.01
申请号 JP19800183446 申请日期 1980.12.24
申请人 FUJITSU KK 发明人 OZAKI RIYOUICHI
分类号 H05K3/32;H01L21/60 主分类号 H05K3/32
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