发明名称 FOAMED PHENOLIC RESIN COMPOSITION
摘要 PURPOSE:To obtain a foamed phenolic resin composition having uniform cell structure, smaller cell size and high closed cell ratio, by using a specific surfactant in the production of a foamed phenolic resin composition with a low-boiling organic foaming agent together with a surfactant and an acidic curing agent. CONSTITUTION:The objective foamed phenolic resin composition can be produced by foaming and curing a precondensate of a resol-type phenolic resin with one or more kinds of surfactants of formula (R1 and R2 are H or methyl; n1 and n2 are >=1; n1+n2=2-50) in the presence of an acidic curing agent (e.g. hydrochloric acid) and an organic foaming agent (e.g. petroleum ether). The amount of the surfactant is preferably 0.5-5pts.wt. per 100pts.wt. of the resol-type phenolic resin precondensate.
申请公布号 JPS63179940(A) 申请公布日期 1988.07.23
申请号 JP19870013019 申请日期 1987.01.21
申请人 SHOWA HIGHPOLYMER CO LTD;DAI ICHI KOGYO SEIYAKU CO LTD 发明人 OGIWARA MASAAKI;ICHIHARA AKINOBU;UKAI MASAHIRO
分类号 C08J9/12;C08J9/14;C08L61/04;C08L61/06 主分类号 C08J9/12
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