| 摘要 |
PURPOSE:To decrease capacitance between wirings and stress in an insulating film and to eliminate interference and transmission delay of electric signals, by forming cavities at the parts of an insulating film between conductors. CONSTITUTION:In an insulating film 4 located between wiring films 3a-3c, cavities 5a and 5b, which have the height approximately equal to the thickness of the wiring films 3a-3c, are formed. The bottom parts of the cavities 5a and 5b are contacted with an insulating film 2 formed on the surface of a substrate 1. The capacitance between the wirings is decreased in comparison with the device, in which only the insulating layer 4 is formed, because of the formation of the cavities 5a and 5b. The cavities 5a and 5b indicate the effect for alleviating stress in the wiring films. This fact contributes to the improvement of the reliability of the wiring.
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