| 摘要 |
PURPOSE:To reduce a manufacturing cost, by performing plastic working on a conductive plate material, thereby forming protruding strips, blanking the plate material so as to form lead pieces so that parts of the protruding strips are located at the tip parts of the lead pieces, using parts of the protruding strips as connecting bumps for an integrated circuit, and forming the lead pieces efficiently. CONSTITUTION:A plate material 1 comprising a conductive material is rolled, and protruding strips 2 and 2 are formed on the upper surface of the plate material 1 in parallel in the longitudinal direction. The protruding strips 2 are formed in a trapezoidal shape so that the upper tip part is narrower than the bottom part. Thereafter, the plate material 1 is blanked and lead pieces 3 are formed so that parts of the protruding strips 2 are located at the tip parts of the lead pieces 3. The lead pieces 3 have parts 2a of the protruding strips 2 at the tip parts of the lead pieces. The parts 2a of the protruding strips 2 located at the tip parts of the lead pieces 3 are used as connecting bumps with an integrated circuit 4 when the integrated circuit is packaged. Since the integrated-circuit connecting lead pieces 3 and the bumps 2a at the tip parts of the lead pieces are formed by mechanical machining such as blanking and plastic working, this method is suitable for mass production, and the devices can be manufactured at a low cost.
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