发明名称 BONDER AND AUTOMATIC BONDING DEVICE USING THE SAME, AND FRAME
摘要 PURPOSE:To quickly discriminate at which bonder a bonding process is conducted for a lead frame on by providing an identification mark giving device with which an identification mark is attached to the lead frame corresponding to the bonder. CONSTITUTION:An identification mark giving device 10, with which an identification mark corresponding to the bonders C1 to C3 having a push mechanism will be given to a lead frame L/F, is attached to the prescribed position of the frame body 5 equipped with the push mechanism 1. The above-mentioned identification mark giving device 10 has a bracket 11 as a base part, and the bracket 11 is attached to the frame body 5 of the push mechanism 1 by a bolt 11a. As a result, even when a plurality of bonders C1 to C3 are incorporated as a line, a decision can be made quickly by which bonder the frame L/F is bonding-processed based on the identification mark given to the lead frame L/F.
申请公布号 JPH05226403(A) 申请公布日期 1993.09.03
申请号 JP19920061560 申请日期 1992.02.17
申请人 KAIJO CORP 发明人 MIZUTANI TAKASHI
分类号 H01L21/60;H01L23/50 主分类号 H01L21/60
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