| 摘要 |
<p>PURPOSE:To prevent the corrosion, etc., of a transparent conductive layer as a foundation effectively, and to manufacture a thin-film element easily at low cost by specifying the pH of the developer and developing time of a resist. CONSTITUTION:A photo-resist 36 is exposed to a specified pattern for the next Al etching and developed and treated, and left as an etching mask, and Al 35 as a foundation is etched while using the photo-resist 36 as a mask. That is, when a thin-film element is manufactured through the etching process of the metallic layer 35 formed onto a transparent conductive layer 34, a developer having pH of 13.0 or less is used and developing is conducted for a developing time within sixty sec in a developing process in which the resist 36 for etching the metallic layer 35 is developed. Accordingly, the metallic layer 35 as the foundation can be developed without being deteriorated, the corrosion and dissolution of the transparent conductive layer 34 are prevented, and the element can be manufactured easily at low cost.</p> |
