| 摘要 |
PURPOSE:To avoid the deterioration in the quality such as the release of a copper foil and solder by a method wherein a conductor pattern is formed in a cutting-off part of a printed substrate formed to be separated at the cutting- off part. CONSTITUTION:In order to form a circuit. pattern 6 on the inner layer of separating printed substrates 2, 3 of a printed substrate 1, a conductor pattern 11 is formed on the part to be a cutting-off part 5 and after the lamination of an outer layer, the circuit pattern 6 is formed on the outer layer. Next, the conductor pattern 11 on the cutting-off part is irradiated with a high output laser 13 such as YAG laser from a laser irradiation device 12. Through these procedures, the basic material near the conductor pattern 11 is locally thermal- cracked for cracking the cutting-off part 5 thereby enabling the printed substrate 1 to be easily cut-off by manual bending step. |
