| 摘要 |
PURPOSE:To prevent the damage on a semiconductor chip by rounding the end part where the bottom of a wedge-bonding-grooved tool and the groove of a tool contact each other. CONSTITUTION:The end part A is rounded, where the grooved bottom face for wedge bonding and the groove of a tool contact each other, and on the end part B where the front and back faces of the tool and the tool groove contact each other. The radius of curvature R of the rounded end part A is 0.2 to 5 times the diameter of the wire used. Consequently, the stress added to the wire can be dispersed uniformly, and as a result, the stress added to a semiconductor chip can also be dispersed uniformly, and the damage on the semiconductor chip can be prevented. |
