Tape bonding apparatus

摘要

A tape bonding apparatus for bonding leads of a film carrier to bumps of a pellet including a linear cam that moves up and down a bonding stage which carries the pellet. A vertical movement adjustment assembly made up with an eccentric shaft, an adjustment lever and an adjusting screw adjusts the relative amount of vertical movement of the bonding stage with respect to the linear cam. A gap sensor detects the amount of the vertical movement of the bonding stage and shows the distance between the leads and the bumps in a numeric value. Thus, the distance or clearance between the leads and the bumps can be adjusted easily.