发明名称 SEMICONDUCTOR DEVICE AND FABRICATION THEREOF
摘要 In a semiconductor device and a method for manufacturing the same according to the present invention, each of electrode pads on a semiconductor chip is bonded to an inner lead section of each of leads of a carrier tape by a connecting electrode. An insulating film of the carrier tape is then adhered to the surface of the semiconductor chip by interposing an adhesive layer between them. Thus, the electrode pads and inner lead sections are stably bonded, and the flatness of the carrier tape is maintained by the flatness of the surface of the semiconductor chip. It is thus possible to prevent the flatness of the outer lead sections of the leads from being degraded when the number of leads is small, and to improve in mounting the semiconductor chip by reflow soldering.
申请公布号 KR0169274(B1) 申请公布日期 1999.02.01
申请号 KR19940018446 申请日期 1994.07.28
申请人 TSHIBA KK 发明人 OKUTOMO, TAKAYUKI;IKEIZU, MORIHIKO
分类号 H01L21/60;H01L23/28;H01L23/495;(IPC1-7):H01L21/60 主分类号 H01L21/60
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