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发明名称
DIE BONDING APPARATUS
摘要
申请公布号
KR0161436(B1)
申请公布日期
1999.02.01
申请号
KR19950030325
申请日期
1995.09.16
申请人
SAMSUNG AEROSPACE INDUSTRIES LTD.
发明人
NAM, SOO-KEUN
分类号
H01L21/52;(IPC1-7):H01L21/52
主分类号
H01L21/52
代理机构
代理人
主权项
地址
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