| 摘要 |
PROBLEM TO BE SOLVED: To discriminate a defective chip easily by wiring external input-output lines so as to be passed between the periphery of a semiconductor chip and the place of pad formation, while measuring the electrical characteristics of an external connecting pad and deciding the defective chip, when the result of the measurement doe not match with desired characteristics. SOLUTION: External input-output lines 7, connected to external connecting pads 5 at the four corners of the chip, are wired so as to be passed among the places of the formation of the external connecting pads 5 and the periphery of the chip and connected with internal circuits 6 at the corner sections of the chip, in which there are the external connecting pads 5. A probe needle is abutted successively against the external connecting pads 5 at four corners first, and diode characteristics are measured from the probe needle. The result of the measurement and specified characteristics are compared, and decided as to nondefective or defective. Accordingly, even when a chip breaking is generated only in the peripheral section of the chip, the chip can be decided as a defective chip and eliminated. |
