P/R HARDENING DEVICE OF P/R COATING EQUIPMENT

摘要

PURPOSE: A photoresist curing device of a photoresist coating apparatus is provided to cure the photoresist in a uniform thickness by curing the photoresist using a radiation heat. CONSTITUTION: A photoresist curing device comprises a chamber. One part of the chamber is openable to allow a wafer(1) to be loaded or unloaded into or from the chamber. A turntable(5) is rotatably installed in the chamber. A resting unit(6) for supporting a periphery of the wafer(1) is fixed at an upper portion of the turntable(5). The turntable(5) is rotated by a driving device including a motor(7) and a driving pulley(8). A heating plate(9) is installed at the upper portion of the turntable(5) for generating a heat when a power is applied thereto. A temperature adjusting device is provided to control the temperature of the heating plate(9).