| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame terminal cutting method with which the cutting margin can be reduced as much as possible, when a package is divided. SOLUTION: This terminal cutting method of a lead frame 10 which is connected to the lead part 12 between the adjacent island parts where an IC chip 13 is mounted and a lead part 12 which connect the IC chip 13 and the outside part, is formed. A plurality of resin packages 15, which seal an IC chip 13, are formed on the island part 11 and the lead part 12 leaving a cutting margin W2, and the lead part 12 between the plural resin packages 15 is cut by introducing in a dicing blade 40 into he cutting margin W2. |
