| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of providing a hardened film superior in heat resistance, close adhesiveness, low water absorptivity, mechanical characteristics, and the like and high in performance by incorporating a specified resin and an epoxy resin, a photopolymerization initiator, and an inorganic filler specified in content. SOLUTION: This photosensitive resin composition comprises (A) a resin having carboxylic groups and ethylenically unsaturated groups, (B) an epoxy resin, (C) a photopolymerization initiator, and (D) an inorganic filler in an amount of 50-85 weight %, preferably 50-65 weight % of the total solid components, and when this content is than 50 weight %, reflow and PCT resistances and warping property deteriorate, and is not desirable, where as if it exceeds 85 weight %, coatability and photocurability and the like are deteriorated, so that this is not desirable. |
