DEVICE FOR DETECTING APPEARANCE OF SOLDER BALLS FOR BGA PACKAGE AND METHOD FOR SETTING OPTIMUM LIGHTING CONDITION THEREOF

摘要

PURPOSE: A device for detecting appearance of solder balls for bga package and method for setting optimum lighting condition thereof are provided to increase reliability of inspecting equipment by detecting whether a lighting condition is suitable even if time passes or inspection surroundings vary before an inspection is performed on a real object. CONSTITUTION: A reference sample is transferred from a reference sample storing unit to an inspecting unit according to a start signal of inspection. The reference sample is measured in the inspecting unit according to an arbitrary lighting condition. A difference(measurement error) between the measurement value of the reference sample and a known real value of the reference sample is calculated. The measurement error is compared with an allowable error to obtain an optimum condition regarding the brightness of lighting.