SEALING MATERIAL AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a sealing material which can reduce the occurrence of poor filling such as non-filling. SOLUTION: The sealing material is obtained by heating and kneading an inorganic filler, epoxy resin, and a curing agent. In the hating and kneading process, water is mixed by 0.05-0.5 mass%. Fluidity at the time of molding of the sealing material is not too high nor too low owing to the water mixed in the heating and kneading process. COPYRIGHT: (C)2005,JPO&NCIPI