| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board, by which a conductor pattern that exhibits an excellent performance can be formed by a simple method, and to provide a printed wiring board. SOLUTION: The method of manufacturing a printed wiring board provided with a substrate (11), a conductor pattern (12), and a wiring pattern (13) includes a step 1 of forming a conductor agent film by using a conductor agent containing at least one kind selected from fine conductive particles, fine heated conductor particles, and an organometallic compound; a step 2 of forming a conductor film by heating the conductor agent film to a temperature of 100-500°C; and a step 6 of forming the conductor pattern (12) by partially etching off the conductor film. Another method of manufacturing the wiring board includes a step 1 of forming a conductor agent film by using a conductor agent including fine conductor particles having a mean particle diameter of≤300 nm and/or fine heated conductor particles, a step 2 of forming a conductor film by heating the conductor agent film, and the step 6 of forming the conductor pattern (12). In addition, the wiring board is obtained by the first-described method or the second-described method. COPYRIGHT: (C)2005,JPO&NCIPI
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