发明名称 |
Process and system to package residual quantities of wafer level packages |
摘要 |
Various preferred processes and equipment are described herein that more efficiently handle residual semiconductor parts during packaging. The processes include picking and removing all of the bad parts from a wafer before picking the good parts and picking all of the good parts first without picking any part necessary to align the wafer. The equipment includes several embodiments of a transfer machine that accommodates the efficient transfer of semiconductor parts between tacky film, waffle packs and tape and reel containment systems. Residual good parts are stored in waffle packs and can be subsequently reused in the packaging process.
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申请公布号 |
US7189938(B2) |
申请公布日期 |
2007.03.13 |
申请号 |
US20050036714 |
申请日期 |
2005.01.14 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
KODURI SREENIVASAN K.;STOVALL MATTHEW J. |
分类号 |
B07C5/344;H01L21/00 |
主分类号 |
B07C5/344 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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