| 发明名称 |
CHIP SELECTION IN AUTOMATIC ASSEMBLY OF INTEGRATED CIRCUIT |
| 摘要 |
A method for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and the knocks a die down from the array of dice into a receptacle for transport to further processing stages. |
| 申请公布号 |
KR930009376(B1) |
申请公布日期 |
1993.10.02 |
| 申请号 |
KR19850070326 |
申请日期 |
1985.11.21 |
| 申请人 |
MOSTEK CORP. |
发明人 |
BOND, ROBERT H.;SWENDROSWSKI, STEVEN;OLLA, MICHAEL A.;ORRISON, BARRY L.;PARKINSON, RICHY;GARRISON, LINN |
| 分类号 |
H01L21/50;B25J7/00;H01L21/301;H01L21/52;H01L21/67;H01L21/683;(IPC1-7):B25J7/00 |
主分类号 |
H01L21/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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