| 摘要 |
PROBLEM TO BE SOLVED: To reduce the time for etching treatment and the time, starting from the end of etching to the start of cleaning, to make the occurrence of etching irregularity during the time less likely to occur, and to reduce the installation space for an etching apparatus. SOLUTION: A semiconductor wafer 18 placed in a treatment tank 1 is subjected to an etching treatment, by repeating a treatment of supplying an etching solution 2 in an etching solution tank 9 to the treatment tank 1, and returning the supplied etching solution 2 into the etching solution tank 9. When the etching treatment is over and the etching solution 2 in the treatment tank 1 is returned to the etching solution tank 9, pure water 3 is immediately supplied to the treatment tank 1 through a pure water supply pipe 14, and the semiconductor wafer 18 placed in the treatment tank 1 is subjected to cleaning treatment. COPYRIGHT: (C)2008,JPO&INPIT
|
