| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a varnish for use in prepregs which does not cause the separation of an epoxy resin and dicyandiamide from an inorganic filler, and to provide a prepreg and a printed wiring board using the varnish. <P>SOLUTION: The varnish for use in a laminated sheet or a prepreg comprises a product by the heat treatment for compatibilizing, in the absence of a solvent, a component that results from so mixing (a) an epoxy resin, (b) dicyandiamide and (c) an imidazole ring-containing compound as to become a ratio of the content of (c) component, relative to (a) component, 0.001-0.03% by weight and another component that results from reacting them in an organic solvent at a temperature higher than 70°C and lower than 140°C, and (d) an inorganic filler; the electrically insulating, flame retardant laminated sheet or the prepreg and also the printed wiring board obtained therefrom are disclosed. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
