| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing apparatus which can polish the central portion of a bevel of a substrate by high polishing pressure. SOLUTION: The polishing apparatus comprises a substrate holding section 32 for holding and turning the substrate W, a pressing pad 50 for pressing the polishing surface of a polishing tape 41 against the bevel of the substrate held by the substrate holding section, and a feed mechanism 45 for feeding the polishing tape in its longitudinal direction. The pressing pad 50 has a hard member 51 having a pressing surface 51a for pressing the bevel of the substrate via the polishing tape, and at least one elastic member 53 for pressing the hard member against the bevel of the substrate via the polishing tape. COPYRIGHT: (C)2009,JPO&INPIT |
