SOLDERING METHOD FOR PRINTED-CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a soldering method for a printed-circuit board such that a soldering device can be made compact and there is no temperature drop etc., after preheating so that stable quality can be secured. SOLUTION: In the soldering method for the printed-circuit board 4 (hereinafter a board 4) wherein the board 4 is held and conveyed on a top surface of a palette 1 having a through opening at a position enclosing a predetermined soldering part of the board 4 while the soldering part is exposed in the through opening 11 and the surface of fused solder is elevated and lowered to perform soldering at the predetermined position through the through opening 11 from the reverse face side of the palette 1, the through opening 11 on the reverse face of the palette 1 which is moving down is blocked with the surface of the fused solder to preheat the inner side of the through opening 11 up to predetermined temperature and then the palette 1 is lowered to dip a part exposed in the through hole 11 in the fused solder 21 for soldering. The timing when the palette 1 having been preheated is lowered is judged by detecting the temperature of the predetermined part of the board by a detecting means. COPYRIGHT: (C)2009,JPO&INPIT