发明名称 COMPACT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a compact module which has an IC with leads extended from a IC body and also has a circuit board on which the IC is mounted, and which can be miniaturized in size. SOLUTION: The compact module comprises an IC 10 having a plurality of leads 12, 12, ..., and 12, a circuit board 30 having a component mounting surface 30a, and a plurality of sets of pairs of terminal stud substrates 15A, 15B, 16A, 16B which are disposed between the component mounting surface 30a of the circuit board 30 and the IC 10 adjacent to the IC body to individually hold respective sides of the leads 12, 12, ..., and 12 of the IC 10, with the IC 10 being mounted on the component mounting surface 30a of the circuit board 30. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009059800(A) 申请公布日期 2009.03.19
申请号 JP20070224366 申请日期 2007.08.30
申请人 TOSHIBA CORP 发明人 SUZUKI DAIGO;AOKI SHIN
分类号 H05K1/18;H05K1/14 主分类号 H05K1/18
代理机构 代理人
主权项
地址