发明名称 |
A DEVICE WITH BONDED CONDUCTIVE AND INSULATING SUBSTRATES AND METHOD THEREFORE |
摘要 |
2102506 9320423 PCTABS00027 A device with bonded and conductive substrates is disclosed. This device includes a conductive substrate (509) having an electrically insulating layer (515) disposed on a portion thereon. An electrically conductive layer (519) is disposed on the electrically insulating layer (515). Then an insulating substrate (101) having a first surface (103) and an opposing second surface (105) with an electrically conductive coating (516) disposed on a portion thereon is provided. Finally, the insulating substrate (101) is bonded to the electrically conductive layer (519). |
申请公布号 |
CA2102506(A1) |
申请公布日期 |
1993.10.03 |
申请号 |
CA19932102506 |
申请日期 |
1993.03.17 |
申请人 |
MOTOROLA, INC. |
发明人 |
CHEN, SHIUH-HUI;ROSS, CARL;TOMASELLO, ROSEANN M.;BRANDES, ANITA G. |
分类号 |
G01L9/00;(IPC1-7):G01L9/12 |
主分类号 |
G01L9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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