发明名称 MOLDING DEVICE AND MOLDING METHOD FOR RESIN-MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a molding device and method for a resin-molded product, easily molding the resin-molded product of a desired shape without generating chips. SOLUTION: Hot wire members 42A, 42B formed of a nichrome wire are installed and fixed between pivot shafts 32A, 32B. The hot wire members 42A, 42B can be rotated by a rotating mechanism 34. When the hot wire members 42A, 42B are rotated in a matter to be molded 14, the matter to be molded 14 is molten in the portion thereof through which the hot wire members 42A, 42B pass, and molded into a desired shape. Since the hot wires 42A, 42B are linear, the flexibility of molding is high. Since the matter to be molded 14 is molten only in the portion thereof which is brought into contact with the hot wire members 42A, 42B, cutting chips do no occur as in a conventional structure in which blades are used. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010017790(A) 申请公布日期 2010.01.28
申请号 JP20080178762 申请日期 2008.07.09
申请人 BRIDGESTONE CORP 发明人 SAKAMOTO TAKAHIRO;SHIIBA TAKAHIRO
分类号 B26F3/12 主分类号 B26F3/12
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