发明名称 |
SEMICONDUCTOR MANUFACTURING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a product, which uses a high frequency plasma process wherein a stray or parasitic capacitance coupling is not substantially formed between a plasma source and portions (such as a substrate and wall) of a process chamber having a ground potential or a potential around the ground potential. Ž<P>SOLUTION: The method for manufacturing the product consists of steps of: subjecting a substrate to treatment with a composition of substances; and using the treated substrate so as to finish the product. At least one of the substances is produced from a species generated by a gaseous discharge excited by a helical resonator equipped with a coil. An integrated current supplied by the capacity coupling of plasma into a coil component having a larger potential than a surrounding shield potential is substantially equal to an integrated current supplied by the capacity coupling of plasma into other coil elements having a smaller potential than a surrounding shield potential. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2010021590(A) |
申请公布日期 |
2010.01.28 |
申请号 |
JP20090246591 |
申请日期 |
2009.10.27 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
VINOGRADOV GEORGY;YONEYAMA SHIMAO |
分类号 |
H01L21/3065;C23C16/50;C23C16/505;H01J37/32;H01L21/205;H01L21/302;H05H1/46 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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