| 摘要 |
The present invention provides a semiconductor package. The semiconductor package comprises: a lower package including a lower semiconductor chip mounted on a lower package substrate, and a lower mold film arranged on the lower package substrate; and an upper package arranged on the lower package, and including an upper semiconductor chip mounted on an upper package substrate. The lower mold film has a guide portion extending in a vertical direction from an edge on the lower package substrate toward the upper package. Therefore, the semiconductor package prevents misalignment caused by the guide portion when the lower package is coupled to the upper package. |
