发明名称 CUTTING-LINE FORMATION METHOD AND CUTTING-LINE FORMATION DEVICE
摘要 The present invention relates to a method and device for forming cutting lines. When each of the multiple cutting lines is formed, the method and device always can match the same location of a circular blade to a side end part of an optical film laminate to initiate cutting. The method, which is for forming cutting lines, includes the processes of: rotating the circular blade; matching a predetermined location on the outer periphery of the circular blade to a side end part of the optical film laminate to initiate cutting the optical film laminate; moving the circular blade in the width direction of the optical film laminate to form cutting lines on the optical film laminate; and conveying the optical film laminate by a preset distance which is the distance between a single cutting line and another cutting line next to the single cutting line.
申请公布号 KR20160067023(A) 申请公布日期 2016.06.13
申请号 KR20150127194 申请日期 2015.09.08
申请人 NITTO DENKO CORPORATION 发明人 MISHIMA JUN;MAEDA MINORU;YURA TOMOKAZU;KOSHIO SATORU
分类号 B26D3/08;B26D1/14;B26D5/00;B26D5/08;B26D5/20 主分类号 B26D3/08
代理机构 代理人
主权项
地址