| 发明名称 | Hard coating forming method | ||
| 摘要 | A hard coating forming method is disclosed that can form a hard coating on surfaces of various manufactured goods including resin products and wood products. The method includes transcribing a coating layer of a sheet having a substrate and the coating layer formed on the substrate, the coating layer containing a thermoset product of a resin composition comprising a resin having an epoxy group and a (meth)acryloyl group and a thiol based curing agent; delaminating the substrate from the sheet; and irradiating light to the coating layer to cure the coating layer. | ||
| 申请公布号 | US9387610(B2) | 申请公布日期 | 2016.07.12 |
| 申请号 | US201113574522 | 申请日期 | 2011.02.09 |
| 申请人 | LG Hausys, Ltd. | 发明人 | Kim Yun Bong;Kim Won Kook;Kang Yang Go;Kim Jin Woo;Kwon Dong Joo;Ryu Mu Seon |
| 分类号 | C08F2/50;B29C45/14;C09D163/00;C08F222/10 | 主分类号 | C08F2/50 |
| 代理机构 | Dentons US LLP | 代理人 | Dentons US LLP |
| 主权项 | 1. A hard coating forming method comprising: transcribing a coating layer of a sheet on a formed product, wherein the sheet has a substrate; and the coating layer that is formed on the substrate contains a thermoset product of a resin composition comprising a resin having an epoxy group and a (meth)acryloyl group, and a thiol based curing agent, wherein the resin has epoxy equivalent weights of 4,000 g/eq to 8,000 g/eq, and (meth)acryloyl equivalent weights of 200 g/eq to 500 g/eq; delaminating the substrate from the sheet; and irradiating light to the coating layer to cure the coating layer. | ||
| 地址 | Seoul KR | ||