| 摘要 |
Provided is a laser processing apparatus with even higher processing efficiency. The laser processing apparatus includes a holding unit (6) that holds a workpiece (11), a laser applying unit (30) that applies a laser beam (L), and a processing feed unit (8) that relatively moves the holding unit and the laser radiating unit in a processing feed direction, an indexing feed unit (8) that relatively moves the holding unit and the laser applying unit in an indexing feed direction, and a control unit (44) that controls the operation of each part. The time required for a stopping step of stopping the laser applying unit relative to the holding unit is denoted by ta, and the time required for an indexing step of indexing an application position of the laser beam at the next division-planned line is denoted by tb. When tb>ta is satisfied, the control unit initiates the stopping and indexing steps simultaneously and performs an initiating step of accelerating the laser applying unit with respect to the holding unit by utilizing the remaining time (tb-ta) of the indexing step after the termination of the stopping step. |
