发明名称 POLISHING PAD
摘要 PROBLEM TO BE SOLVED: To provide a polishing pad which has a long life cycle and is excellent in polishing efficiency.SOLUTION: A polishing pad 10 is a polishing pad for removing a metal film provided on the surface of a polishing object, and has a base material 11 and a polishing layer 12. The base material 11 has a first surface (surface 11a) facing the polishing object, and is formed of a material having voids. The polishing layer 12 has a curable resin film 121 which is selectively provided on the first surface, and polishing abrasive grains 122 which are fixed to the curable resin film 121 and come in contact with the metal film.SELECTED DRAWING: Figure 2
申请公布号 JP2016140937(A) 申请公布日期 2016.08.08
申请号 JP20150017693 申请日期 2015.01.30
申请人 FUJIBO HOLDINGS INC 发明人 SAEKI TAKU;MAEDA TOSHIHIDE
分类号 B24D11/00;B24B7/22;B24B37/22;B24D3/00;H01L21/304 主分类号 B24D11/00
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